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Micron currently has 12” FABs in Taoyuan and Taichung respectively. The IC packaging and testing plant in Taichung is close to its wafer plants. Therefore, the IC’s manufacturing, packaging and testing are in one place. It is favorable to Micron’s business development and strengthens the company’s layout in Taiwan and is also a key step for Micron to build a one-stop DRAM manufacturing center in Taiwan.
At present, Micron’s Taoyuan and Taichung Plants adopt 1Xnm process. It is expected that Taoyuan Plant may start the mass production of 1Ynm process next year and Taichung Plant may introduce 1Znm process in 2019 and start the mass production in 2020. In the future, product testing will all be done in its IC packaging and testing plant in Taichung.
After Micron’s IC packaging and testing plant in Taichung has been completed and kicked off, Powertech’s (6239-TW) and Walton’s (8110-TW) orders may drop. In the past, the mobile DRAM produced by Micron was packaged by this two companies.
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